XSW-320 Gated

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XSW-320 Gated

OEM module for SWIR gated imaging

Extremely short 100 nsec integration time for SWIR gated imaging

The XSW-320 Gated SWIR OEM module operates in the 0.9 to 1.7 μm spectral band and provides extremely short integration times (down to 100 ns). Its InGaAs detector has a resolution of 320 x 256 pixels and a pixel pitch of 20 µm. 

A special feature of the XSW-320 Gated is the programmable trigger-out delay between the internally generated trigger-out pulse and the start of integration. The exposure time of the sensor is configurable from 100 ns up to 1 ms in steps of 100 ns, or 1 ms to 40 ms (standard mode).

With all these features, the XSW-320 Gated is the perfect SWIR OEM module for SWIR gated imaging, the inspection of light bulbs and SWIR imaging of hot or fast moving objects.

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Преимущества и особенности

  • CameraLink or Ethernet standard interfaces
    CameraLink or ethernet machine vision interfaces
  • Extreme short 100 nsec integration time
    Short exposures for advanced, eye safe laser gated imaging systems
  • Flexible programming in an open architecture
    SDK (Software Developing Kit) available for all cameras - samples available for C++, LabView, Linux…
  • High sensitivity and excellent image quality
    Low noise and high dynamic range modes
  • Programmable trigger out
    Variable delay on trigger out

Предназначен для использования в

  • Laser gated imaging
    Long distance imaging minimizing the effect of obscurants in the atmosphere
  • Measurement systems needing synchronisation of the camera with a pulsed laser
    The camera has a trigger output function to synchronise with a pulsed laser
  • Imaging of hot or moving objects such as light bulb or turbine blades inspection
    The camera is able to work at very short integration time. Possible to see hot object without going into saturation or image blur
  • R&D (SWIR) with short integration times
    Gated imaging in SWIR using eye safe lasers

Oсобенности

Compatible with a variety of framegrabbers

Several compatible frame grabbers for CameraLink interface are available (Euresys Grablink Full, NI 1433 and Imperx Framelink Express VCE-CLEX01).

GigE Vision standard compatibility

The Gigabit Ethernet interface is compatible to the GigE Vision standard

High dynamic range

High dynamic range mode available

SWaP (Small size, weight and power )

Small volume, low weight and low power consumption for demanding applications

Trigger

External trigger for signal synchronization

TrueNUC image correction

Non uniformity correction for a wide range of integration times

Windowing mode

Imaging in a reduced window of interest for increased frame rates

технические характеристики камеры

Array Specifications

Array Specifications XSW-320 Gated
Array type InGaAs Focal Plan Array (FPA) ROIC with CTIA topology
Resolution 320 x 256
Pixel pitch 20 μm
Spectral band 0.9 μm to 1.7 μm
Pixel operability > 99 %
Array cooling TE1-stabilized
ROIC noise 60 e-
Dark current 0.19 x 10⁶ e-/s/pixel or 30 fA @ 200 mV bias at 288 K
Full well capacity 125 k e-

Module Specifications

Module Specifications XSW-320-Samtec Gated XSW-320-CL Gated XSW-320-GigE Gated
Imaging performance
Maximum frame rate (full frame) 400 Hz
Window of interest Minimum size 32 x 4
Exposure time range 0.1 µs to 40 ms
Readout mode Integrate Then Read (ITR)
Noise 110 e-
Dynamic range 61 dB
ADC 14 bit
On-board image processing Auto-Gain, Auto-Offset, Auto-Exposure Auto-Gain, Auto-Offset
Interfaces
Optical interface C-mount
Digital output 16bitDV/BT.656 CameraLink GigE Vision
Module control Samtec CameraLink GigE Vision
Trigger Trigger in or out (configurable)
Power requirements
Power consumption 2.5 W 2.8 W 4 W
Power supply 12 V
Physical characteristics
Ambient operating temperature range -40ºC to 70ºC (industrial components)
Storage temperature range -40ºC to 85ºC (industrial components)
Dimensions (W x H x L mmᵌ) 45 x 45 x 51 45 x 45 x 55 45 x 45 x 65
Weight module 120 g 129 g 165 g

Широкий ассортимент аксессуаров

Варианты объективов и фильтров

Software

  • Xeneth
  • Xeneth SDK (optional)

Документы

Technical documents
T3 XSW H This file contains all the technical documents for the XSW camera core.

Брошюры

Modules & components brochure XSW-320-Gated

World's first InGaAs camera photon emission microscope

Xenics enabled Semicaps to realize the world's first InGaAs camera photon emission microscope in 2004. Since then Xenics and sInfraRed have supported us in our endeavors for better sensitivity and resolution in photon and thermal emission microscopy.

Chua Choon Meng, CEO Semicaps